SEOUL, South Korea / RankWire.AI / – Samsung Electronics has introduced new approaches in memory and storage technology aimed at enhancing artificial intelligence systems. The company announced these initiatives during the 2026 OCP Global Summit in San Jose, California, which took place from October 12 to 15. Its plan emphasizes high-performance memory, expanding memory capacity through Compute Express Link, and next-generation solid-state drives. Additionally, Samsung will collaborate with AMD to showcase a joint CXL demonstration. These efforts are designed to address existing capacity limitations faced by current AI servers.
Samsung outlined its strategy based on three main objectives: increasing speed, improving memory scalability, and ensuring data persistence. To boost speed, the company presented customized high-bandwidth memory, alongside the eighth-generation HBM5 technology. For scalability, Samsung promoted CXL as a solution to add more capacity beyond the memory installed within each server. Regarding data persistence, the firm introduced next-generation SSD-based storage and management technologies. It also showcased storage software designed to enhance data processing efficiency for AI applications.
Samsung emphasized that the increasing deployment of AI agents is creating a higher demand for memory during inference processes. Larger models generate more data as they respond, and this data must remain accessible to processors. Traditional systems restrict the amount of memory each processor can access. To address this, Samsung introduced CXL technology as an effective method to surpass such limitations. The company also demonstrated key-value cache optimization, allowing AI models to reuse previously processed data instead of repeating computations.
Partnership with AMD Extends to CXL Memory Expansion
In collaboration with AMD, Samsung will jointly demonstrate a CXL-based solution that increases memory capacity in AI systems. This technology enables processors to share memory resources, moving beyond reliance solely on local server memory. Samsung reports that engineers have validated this solution in real system environments. The demonstration builds upon a memorandum of understanding signed by both companies in March 2026, focusing on next-generation AI memory and computing. AMD CEO Lisa Su visited Korea on October 7, where she met Jeon Young-hyun, Vice Chairman of Samsung’s Device Solutions division.
Memory pooling was another highlight of Samsung’s showcase. The company displayed CMM-D, a CXL-based DRAM module that connects multiple memory units into a shared pool. Systems can draw capacity from this pool when workloads demand more resources. Samsung also presented processing-in-memory technology, which performs some calculations within memory chips to reduce data movement and energy consumption. The exhibits included 2-nanometer gate-all-around wafers, Groq LPU wafers, and Nvidia’s Groq 3 LPX system.
Early Co-Design Efforts Shape Samsung’s AI Memory Roadmap
Shim Ho-jun, Corporate Vice President and Head of Samsung’s Application Engineering Team, shared details of the company’s plans during an executive session. He noted that the growth of larger AI models and increased inference demand make higher memory capacity and bandwidth critical for system performance. Shim also highlighted Samsung’s expansion of co-design and technical validation activities with global partners from the earliest stages of development. The goal is to align memory and storage products more closely with customer system architectures.
Samsung MAX Lab provides clients with a facility to evaluate memory and storage solutions under real-world AI workloads. The lab also offers co-design services tailored to specific system configurations. Customers can test pre-commercial technologies, including PIM and next-generation SSDs, before they are available on the market. Samsung participated in the summit as a Diamond Sponsor. This event follows its appearances in 2026 at Nvidia GTC, COMPUTEX, and the Future of Memory and Storage conference, as the company continues to expand its presence in AI memory innovation.